(1) Phase change immersion liquid cooling technology: The phase change cooling system is divided into one type and split type, and its composition mainly includes the following parts: coolant, sealed cavity (seal, pressure-pressure control system), chip cooling film Module (radiation cover), cooling module (CDM) and outdoor cold source. Among them, the cooling module is composed of pipelines, liquid-vapor heat exchangers, circulation pumps, liquid reservoirs and valves. Outdoor cooling sources include air-cooled units, water-cooled units, water spray cooling systems and closed cooling towers. The phase change immersion liquid cooling scheme is an efficient and promising cooling scheme for data centers. Even if the server is running at full load, the overall temperature of the server can still be maintained within an appropriate range.
(2) Single-phase immersion liquid cooling technology: Single-phase liquid cooling technology belongs to the cutting-edge technology of immersion liquid cooling. This technology overcomes the limitation of the operating environment of IT equipment in the past - the electronic components of IT equipment together with the equipment are completely immersed in special liquids In the liquid phase environment, it operates stably and forms a completely closed heat conduction circuit. Compared with traditional air-cooled and cold-plate liquid-cooled technologies, its performance is greatly improved, and it is almost completely free from the influence of humidity, dust and vibration, which optimizes the operating environment of the server and prolongs the life of the equipment. High refrigeration efficiency, energy saving and environmental protection. Although the prospect of non-phase-change liquid cooling technology is good, it has not been popularized due to its high requirements on IT equipment and high cost. At present, this technology is mainly used in supercomputing fields that require extremely high heat dissipation performance. However, with the improvement of heat dissipation requirements in data centers, it is bound to become one of the mainstream heat dissipation technologies in data centers in the future.